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Labour Relations Act, 1995 (Act No. 66 of 1995)

Notices

Bargaining Council for the Metal and Engineering Industries

Main Collective Agreement

Part 2

4. Technical Schedules

Schedule D

Division D/23

Wage Rates Applicable to Operations Scheduled in Division D/23 are Prescribed in Clause 3(a) of Part II of this agreement

 

 

RATE A

1. Telecommunication electrician’s work.
2. Telecommunication mechanician’s work.
3. Calibrating of electrical instruments and/or dials and/or measuring equipment.

 

RATE AA

1. Electrical functional testing and/or fault localising to schematic drawings and/or specifications (n.e.s.).
2. High potential functional testing and/or fault localising when performed by persons normally engaged in operative processes (n.e.s.).

 

RATE B

1. Edge lapping of crystal blanks by hand, excluding calibration.

 

RATE C

1. All wiring and/or cable forming operations (including the preparation of) involving reference to schematic drawings (n.e.s.).
2. Cutting of raw quartz and/or crystal blanks by semi-automatic machine, including setting of angles to predetermined settings (n.e.s.).
3. Assembling of cabinets and/or frameworks where no fitting adjustments are required.

 

RATE D

1. Assembling (n.e.s.) where no fitting adjustments are required.
2. Mechanical and/or electrical checking of equipment involving predetermined electrical measurements and/or drawings prior to or where no functional testing is involved, excluding rectification or repairs of such equipment.
3. Complete sequential adjustment of two-motion selectors to predetermined limits.
4. Hand contouring and checking of crystal blanks to pre-set limits of frequency.
5. Repetitive visual and/or electrical testing of system discs under stereomicroscope.
6. Semi-automatic lapping and/or polishing of crystal blanks to predetermined frequency limits, including checking of frequency (n.e.s.).
7. Setting of stops on guillotine for cutting insulation only.
8. Setting of stops on tube and/or pipe bending machine.

 

RATE DD

1. Testing and alignment of crystal filters against predetermined limits using printout results from automatic test equipment, alignment being achieved by suitable changes of components in filter.
2. Checking and/or adjusting of crystals and/or crystal blanks to predetermined limits of frequency by evaporation and/or by etching and/or by hand.
3. Checking the cutting angle and/or correction factor of raw quartz and/or crystal blanks to predetermined limits during the process of manufacture.
4. Operating nibbling machines (n.e.s.) for batch and/or mass production on material 4 mm thickness or less.
5. Repetitive production lapping and/or checking of quartz crystal blanks to predetermined limits of time and thickness, using pre-set gauges.
6. Repetitive visual checking of system discs by comparison under standard microscope.
7. Supervision of Rate DDD to E employees.
8. Assembly and/or modification of sample printed circuit boards to instructions and/or sketches and/or photographs and/or diagrams.

 

RATE DDD

1. Adjustments to predetermined limits of electrically and/or mechanically operated assemblies.
2. All operations in the making of cable forms without reference to drawings (n.e.s.).
3. Assembly to sample and/or instructions and/or pictorial sketches and/or planning cards of telephone assemblies and/or selector assemblies and/or teleprinter and/or capacitors (n.e.s.).
4. Bonding of wires from transistor dice contact areas to terminal posts by means of a jig under microscopic vision (n.e.s.).
5. Friction alloying and/or wafer bonding and/or ultrasonic bonding of dice to headers by means of a jig under microscopic vision (n.e.s.).
6. Micro welding and/or nail-head bonding and/or ultrasonic bonding of gold wire to transistor leads under microscopic vision (n.e.s.).
7. Operating engraving machine, including the changing of type but excluding tool setting.
8. Repetition high potential insulation testing with foolproof testing instrument.
9. Repetitive batch checking of equipments and/or subunits and/or components to running out lists and/or samples and/or planning cards and/or pictorial sketches and/or photographs, including buzzing.
10. Repetitive batch mechanical and/or electrical checking and/or adjusting of equipments and/or subunits and/or components by comparison with fixed standards with predetermined limits by means of comparators and/or deviation meters and/or special purpose test gear (n.e.s.).
11. Soldering by hand (n.e.s.).
12. Visual checking of crystal and/or crystal blanks during the manufacturing cycle.
13. Winding on hand and/or semi-automatic machines to planning cards and/or sketches and/or diagram, including changing of self-locating mandrels and/or formers (n.e.s.).
14. Wiring to instructions and/or running out lists and/or planning cards and/or pictorial sketches and/or samples and/or audio aids and/or photographs of equipment racks and/or shelves and/or panel details and/or units, including soldering and/or wrapping of wires (n.e.s.).
15. Colouring of wires, using semi-automatic machines.
16. Preparing of bobbins and/or formers, i.e. deburring, facing, painting and varnishing.
17. Installation of radio communication equipment into vehicles under Rate A supervision.
18. Wiring of radio shelters under Rate A supervision.
19. Operating flow-solder machine, including checking of solder temperature and maintaining solder-bath levels.
20. Preforming of the ends of electronic components to instructions and/or sketches on machines, including the cutting of the ends and the adjustment of the machines by means of a calibrated dial.
21. Changing and/or replacing of components on printed circuit boards to specific instructions.
22. Operating a resin dispensing unit, including the filling of pressure chambers, and adjusting pressure according to laid-down instructions.  Checking of resin and hardener mixture by weighing on a gram scale and adjusting of dispensary unit.  Filling of prepared ring core coils with resin and loading into vacuum chamber.
23. Selection of marked dice under microscope.
24. Mirror loading of dice, using vacuum pencil under microscope.

 

RATE E

1. Assembling and/or soldering of electrical components to mountings.
2. Assembling and/or soldering and/or strapping of components to printed circuit boards, using samples and/or pre-marked boards.
3. Marking of system discs by automatic machine where manual operations are limited to loading, aligning the disc and unloading, excluding setting up of machine.
4. Production assembly and/or wiring to samples and/or planning cards and/or audio aids in jigs and/or fixtures and/or self-locating parts, including soldering and/or wrapping of wires.
5. Repetitive preparation of job description cards for cutting preformed cables to lengths.
6. Slitting system discs on semi-automatic machine, excluding setting up of machine.
7. Spotting and/or burnishing and/or wiring and/or sputtering and/or lining and/or edge cleaning and/or pasting and/or damping mass assembly and/or wire forming and/or corner dipping and/or mounting of crystal blanks by use of jigs and/or fixtures and/or machines.
8. Strapping, including sleeving and/or soldering.
9. Visual checking and/or touching up of printed circuit boards during the process of manufacture.
10. Wiring of relay bars and/or frames and/or terminal blocks to instructions and/or running out lists and/or samples and/or audio aids, including wrapping of wires.
11. Touching-up of paintwork on main and/or sub-assemblies.
12. Transferring of data to EPROMS, using automatic programmable apparatus.
13. Winding of ring core coils by hand, including tinning of wire-ends and fitting into casings and cutting wires to length.

 

RATE F

1. Cutting and/or trimming of components, using jigs, by power saw and/or hand press.
2. Cutting of printed circuit boards to marks.
3. Laying and binding of cable forms from prepared running out lists on prepared cable form boards not exceeding 1 m x 1,25 m.
4. Loading of components into, and unloading from, automatic test gear.
5. Mirror loading of dice, using vacuum pencil, excluding use of a microscope.
6. Operating coding machines and/or press and/or fixtures, including change of type.
7. Pen writing to samples and/or instructions and/or pictorial sketches and/or photographs.
8. Repetition production machining of bar and/or tube on capstan lathes to stops where the work piece is held by devices not necessitating any centralising or trueing, excluding setting up. (This operation is limited to a machine not exceeding a 52 mm nominal bore diameter.)
9. Repetition production winding by machine of prepared bobbins to predetermined number of turns, using round wire, including changing of bobbins (maximum length of bobbin 150 mm).
10. Selection of components and/or piece parts into work trays as per selection lists.
11. Separating and/or breaking of system discs, excluding setting of machine.
12. Washing and/or cleaning and/or packing of wafers/blanks.
13. Operating of a semi-automatic transfer printing machine, including the preparation and mixing of printing ink.
14. Operating a semi-automatic wire cutting and stripping machine, including the changing of wire lengths by operating of pre-set dials and removal and affixing of pre-set dies for differing wire diameters.

 

RATE G

1. Coding and/or silk screening to samples and/or instructions and/or pictorial sketches and/or photographs.
2. Dip and/or flow soldering of printed circuit boards.
3. Dipping and/or impregnation in insulating medium and/or enamel and/or paint and/or varnish and/or wax and/or resins.
4. Fly and/or treadle and/or manual pressing and/or notching and/or power pressing, where the work is operated upon with pre-set dies (excluding setting of dies).
5. Hand bending and/or forming to jigs and/or formers and/or stops.
6. Operating nibbling machine to templets and/or stops and/or marks (plate not exceeding 4 mm in thickness).
7. Operating power saw and/or band saw for repetitive cutting off to stops and/or length gauges (excluding setting of stops).
8. Repetition crimping of terminals.
9. Repetition cutting and/or slicing of raw quartz and/or crystal blanks on fully automatic machines, where the work cycle is confined to loading and/or unloading of work piece.
10. Repetition drilling to pre-marked pops and/or dimples and/or jigs and/or fixtures and/or stops, including countersinking and/or reaming by non-adjustable reamers, excluding radial drill.
11. Repetition hot and/or cold blanking and/or piercing by press, using guides and/or jigs and/or stops and/or dies.
12. Repetition machine punching to jigs and/or stops and/or gauges and/or marks.
13. Repetition marking to templets and/or jigs.
14. Repetition preparation of coil bobbins, including the application of shunt windings.
15. Repetition production assembly in jigs and/or fixtures and/or of self-locating parts from stocks where no fitting or adjustment is required, but including deburring.
16. Repetition production tinning and/or soldering of crystal cans.
17. Repetition spot and/or seam and/or projection and/or stud and/or butt and/or flash welding.
18. Repetition tinning of coil bobbin terminals.
19. Repetitive batch checking of piece parts and/or components by means of pre-set fixed gauges under supervision.
20. Riveting not exceeding 10 mm diameter rivets and/or eyeletting.
21. Routine air leak testing.
22. Spraying of enamel and/or paint and/or insulating medium and/or anticorrosive coatings, under supervision, other than blending.
23. Sticking and/or unsticking of raw quartz and/or stacking and/or bonding of crystal blanks to carriers prior to and/or after subsequent machining.
24. Stripping and/or etching of crystal blanks during the process of manufacture.
25. Washing and/or cleaning and/or coating and/or exposing and/or developing and/or etching of printed circuit boards and/or blanks.

 

RATE H

1. Application of insulating medium (n.e.s.).
2. Repetition cutting and pre-forming sets of wire to jigs and/or fixtures.
3. Repetition stripping of insulated wire and/or cable by pre-set tools.
4. Attending electroplating bath under instruction of a Rate A employee.
5. Attending oven.
6. Compound filling.
7. Despatch packing.
8. Dipping and/or impregnating in insulating medium and/or enamel and/or paint.
9. Dip tinning in solder pot.
10. Metal buffing and/or polishing and/or finishing.
11. Metal cleaning by pickling and/or degreasing.
12. Metal coating by dipping.
13. Rethreading and/or retapping by hand.
14. Sand and/or shot blasting.

 

Manufacturing of electrical and/or electronic components for sale in bulk.

 

Rate A

1. Artisan’s work.

 

Rate C

1. Setter.  Setting, maintaining and servicing of metalised capacitors and suppression manufacturing equipment.

 

Rate DD

1. Supervisors.  Supervising section leaders.

 

Rate E

1. Section leaders.  Monitoring of feeders and/or core winders, including supervision of preliminary preparation of production equipment by Rate H employees.

 

Rate H

1. Feeders.  Repetition loading and/or feeding of equipment, magazines, wheels or bowls with components, including simple preliminary preparation of production equipment under supervision.
2. Core winders.  Repetitive automatic and/or manual winding of wire onto cores or bobbins.”

 

Surface Mount Technology Operations

 

1. Rate B

Surface mount technology supervisor, supervising surface mount technology operators and surface mount technology inspectors.

 

2. Rate AA

Surface mount technology production assistants, engaged in the following types of activities:

▪ Programming, setting, servicing and maintenance of surface mount technology machines (including printers, ovens, and pick and place machines and inspection equipment);
▪ Supervision of the machine operations done by surface mount technology operators; and
▪ File handling and back up of product data.

 

3. Rate DDD

Surface mount technology inspectors, engaged in the following types of activities:

▪ Visual inspection and verification of “first-off” printed circuit boards using parts lists and printed circuit board layout drawing and microscope; and
▪ Repetitive visual inspection of assembled printed circuit boards according to pre-defined standards (using microscopes or automatic inspection equipment).

 

4. Rate F

Surface mount technology operators, engaged in the following types of activities:

▪ Printing of solder paste onto printed circuit boards (manual and automated printing);
▪ Loading of printed circuit boards in pick and place machines;
▪ Loading and monitoring of component feeders on pick and place machines;
▪ Loading and unloading of magazines;
▪ Basic operation of various production machines;
▪ Placing components on printed circuit boards
▪ Touch-up printed circuit boards, including single-component hand soldering;
▪ Counting of printed circuit boards and components; and
▪ De-panelising of printed circuit boards